Cross Section of the month

December

µ² Pack

µ² Pack

Potential

  • Super Thin Multi Chip Packaging, System In Package (SIP)
  • Customer Specific Pad Out
  • Improved Ron, Rth, Zth compared to classical bond wires and -stripes
  • Miniaturisation

November

p² Pack® DSV Technology

p² Pack® DSV Technology
p² Pack die attach option with Double Sided Vias

Potential

  • Significantly improved switching behavior
  • Miniaturization

October

HF Board

HF Board

Potential

  • Asymmetrical mix layups
  • Special base materials like PTFE with ceramics and glass ceramics
  • Set up of resonators and aerial geometries with tightest tolerances in the circuit pattern

Application examples

  • Long Range Radar
  • Medium Range Radar
  • Vehicle Exit Assistance Radar
  • Lane Change Assist
  • Rear Pre-crash Radar
  • Blind Spot Detection
  • Cross Traffic Warner
  • Fuel Level

September

Heavy Copper Board: 48V/12V DC/DC – Inverter

Heavy Copper Board
48V/12V DC/DC – converter

Potential

  • Heavy Copper layer construction for high current flows
  • Power layer with 4 x400 µm Cu
  • Logic layer with 4 x70 µm Cu
  • Currents up to 200 Ampere with logic control

Application examples

  • 48V/12V DC/DC – converter for Automotive
  • In cooperation with Infineon

August

Power Combi Board

Power Combi Board

Potential

  • 2 different layer constructions combined within 1 PCB
  • Fine line technology in the logic section, high currents in the power section

Application example

July

High Current PCB Copper Inlay Technology

Inlay Board
High Current PCB Copper Inlay Technology

Potential

  • Multilayer PCB combined with thick Cu Inlays
  • Highest current capability and low resistance
  • Excellent thermal resistance and heat spreading
  • High mechanical stability
  • Automotive qualified

Application examples

June

Smart p² Pack

Smart p² Pack

Potential

  • Combination of logic and power
  • p² Pack performance levels with high-current connection (heavy copper) and overlying logic level (fine line)
  • Maximum miniaturisation
  • Shortest possible signal paths

Application examples

  • Inverters, DC-AC Converter
  • High-current bridge circuits

May

Heavy Copper T² (Thinner and Thermally enhanced)

Heavy Copper T²
(Thinner and Thermally enhanced)

Potential

  • By using pre-filled etched trenches, the number of prepegs can be minimised, thus reducing the isolation distance to the heavy copper material and the thickness of the PCB
  • Direct laser via connection to the heavy copper layer possible
  • Thermal resistance can be reduced by 50% compared to standard solutions
  • Reduced isolation distance leads to improved TWT features

Application examples

  • DC/DC Converter
  • Complex Engine Controls

April

i² Board® Technology

i² Board® - Embedding of active and passive components

Potential

  • All applications where further miniaturisation is only possible by burying components
  • Also with applications where access to the integrated chip is to be prevented (manipulation security)

Application example

March

p² Pack®  Technology

p² Pack®  Technology

Potential

  • Significantly improved electrical and thermal performance
  • Better Rth and more rugged design compared to ceramics
  • Better form factor / less height compared to conventional solutions

Application example

February

IMS

IMS with 2 copper layers

Potential

  • Insulated thermal via connection
  • Several added layers possible
  • Best heat dissipation through thermal prepregs

Application example

  • LED heat dissipation
  • Substitution of DCB

January

FR4 Flex

FR4 Flex bent with 90° of copper in the bending area

Potential:

  • Up to 180° bending angle
  • Up to 3 layers copper in the bending area
  • Design for multiple bents

Application sample