Rainer Jäckle
Product Marketing Manager
(System Cost Reduction)
Phone: +49 7422 512-291
E-Mail: rainer.jaeckle@schweizer.ag
The module approach is an embedding alternative to the classic „motherboard embedding“. In this case, modules with different functionalities are being built onto a base PCB which thus allows for a modularisation according to cutomers’s requirements.
The µ² Pack is excellently suitable for the implementation of such modules. By applying µ² Pack technology, very thin modules with several components and very fine pitch can be realized.