PCB of the Month - December

Description:

  • Power Combi Board in cooperation with ADCOS
  • 4 x 400 µm Cu in the inner layer (power section)
  • 4 x 35 µm Cu in the inner layer (logic section)
  • 2 x 105 µm Cu common outer layer
  • Thermal vias plugged and capped

Highlights:

  • 2 different layer constructions combined within 1 PCB
  • Fine line technology in the logic section
  • High currents in the power section

Customer Benefits:

  • Highest reliability for connecting logic and power
  • Only 1 instead of 2 PCBs

Applications:

  • High power drives for automotive and industrial applications