PCB of the Month - November


  • Power Combi Board in cooperation with Infineon
  • 2 x 400 µm Cu in the inner layer (power section)
  • 4 x 35 µ Cu in the inner layer (logic section)
  • 2 x 50 µ Cu common outer layer
  • FR4 Flex for optimized space usage


  • 2 different layer constructions combined within 1 PCB
  • Fine line technology in the logic section
  • High currents in the power section

Customer Benefits:

  • Highest reliability for connecting logic and power by FR4 Flex technology
  • Only 1 instead of 2 PCBs
  • System cost reduction by elimination of connectors and flat cables


  • Motor controllers in automotive and industrial applications