High Tech Manufacturing for High Tech Products
High Density Interconnection (HDI) technology enables a
miniaturization of the printed circuit board in close connection with
the laser via technology. By using HDI technology we are able to
produce printed circuit boards of highest complexity a process that
would not be feasible by applying conventional Multilayer production.
Laser via drillings permit a surface gain of approx. 70% on the printed
circuit board and additionally facilitates a higher component density.
With one of the most technologically advanced and modern printed circuit
board manufacturing plants in Europe and a highly motivated team of
specialists we are in the position to optimally convert your