High Tech Manufacturing for High Tech Products

High Density Interconnection (HDI) technology enables a miniaturization of the printed circuit board in close connection with the laser via technology. By using HDI technology  we are able to produce printed circuit boards of highest complexity  a process that would not be feasible by applying conventional Multilayer production. Laser via drillings permit a surface gain of approx. 70% on the printed circuit board and additionally facilitates a higher component density. With one of the most technologically advanced and modern printed circuit board manufacturing plants in Europe and a highly motivated team of specialists we are in the position to optimally convert your requirements.