Design rules for laserdrilled HDI-PCBs

Properties:

  • Base material: FR4 or higher grade
  • max. 18 layers
  • PCB thicknesses from 0,6 mm to 3,2 mm
  • final layer with signature printing
  • peelable ink
  • copper thickness from 0,012 mm to 0,090 mm

Application:

Control units for cars, consumer- and communications-electronics, Industrial electronics.

 

Design rules for Microvialayer - MVL:

tl_files/3-Technologien/images/designrules/hdi/drhdi_1.png

Symbol Description HDI (1) High End (2)
       
A Line width at copper thickness of ≥ 36 µm Cu 100 µm 80 µm
A 1 Line width at copper thickness of 25 – 35 µm Cu 90 µm 75 µm
A 2 Line width at copper thickness of 10 – 18 µm Cu 75 µm 50 µm
B Spacing at copper thickness of ≥ 36 µm Cu 125 µm 100 µm
B 1 Spacing at copper thickness of 25 – 35 µm Cu 100 µm 85 µm
B 2 Spacing at copper thickness of 10 – 18 µm Cu 75 µm 75 µm
C Distance line to pad on inner layer 100 µm 85 µm
D Insulation spacing line to pth-drilling 300 µm < 200 µm
E Drill size laser drilling on outer layer 125 µm < 100 µm
F Pad size diameter landing pad on inner layer 330 µm 250 µm
G Diameter capture pad outer layers 330 µm 250 µm
H Diameter CNC-hole 250 µm 150 µm
I 1 Diameter Pad CNC-hole outer layers 350 µm 250 µm
I 2 Pad diameter CNC-hole inner layers (annular ring > 0 µm) 450 µm 350 µm
K Base copper outer layer max. 18 µm max. 12 µm
L / E Aspect ratio microvia 1 : 2 1 : 1,5
Z / H Aspect ratio pth-holes 6 : 1 10 : 1

(1) process capability (CpK > 1,33)
(2) realisation after clarification


Design rules for two and more microvia layers – MVL, staggered vias:

tl_files/3-Technologien/images/designrules/hdi/drhdi_2.png

Symbol Description HDI (1) High End (2)
       
A Line width at copper thickness of ≥ 36 µm Cu 100 µm 80 µm
A 1 Line width at copper thickness of 25 – 35 µm Cu 90 µm 75 µm
A 2 Line width at copper thickness of 10 – 18 µm Cu 75 µm 50 µm
B Spacing at copper thickness of ≥ 36 µm Cu 125 µm 100 µm
B 1 Spacing at copper thickness of 25 – 35 µm Cu 100 µm 85 µm
B 2 Spacing at copper thickness of 10 – 18 µm Cu 75 µm 75 µm
E Drill size laser drilling on outer layer 125 µm < 100 µm
F Pad size diameter landing pad on inner layer 330 µm  250 µm
G Diameter capture pad outer layers 330 µm  250 µm
H Diameter CNC-hole 250 µm 150 µm
I 1 Diameter Pad CNC-hole outer layers 350 µm 250 µm
I 2 Pad diameter CNC-hole inner layers (annular ring > 0µm) 450 µm 350 µm
K Base copper outer layer max. 18 µm max. 12 µm
M Hole to hole distance laservia 350 µm 250 µm
L / E Aspect ratio 1 : 2 1 : 1,5

(1) process capability (CpK > 1,33)
(2) realisation after clarification



Microsection of a staggered via HDI:

tl_files/3-Technologien/images/designrules/hdi/staggered-HDI_web2.jpg



Design rules for skipped vias:

tl_files/3-Technologien/images/designrules/hdi/drhdi_4.png

Symbol Description HDI (1) High End (2)
       
A Line width at copper thickness of ≥ 36 µm Cu 100 µm 80 µm
A 1 Line width at copper thickness of 25 – 35 µm Cu 90 µm 75 µm
A 2 Line width at copper thickness of 10 – 18 µm Cu 75 µm 50 µm
B Spacing at copper thickness of ≥ 36 µm Cu 125 µm 100 µm
B 1 Spacing at copper thickness of 25 – 35 µm Cu 100 µm 85 µm
B 2 Spacing at copper thickness of 10 – 18 µm Cu 75 µm 75 µm
E 1 Diameter of microvia 125 µm < 100 µm
E 2 Diameter of microvia 200 µm 125 µm
F Pad size diameter landing pad on inner layer 330 µm 250 µm
G 1 Diameter capture pad outer layers 330 µm 250 µm
G 2 Diameter capture pad outer layers 330 µm 250 µm
H Diameter CNC-hole 250 µm 150 µm
I 1 Diameter Pad CNC-hole outer layers 350 µm 250 µm
I 2 Pad diameter CNC-hole inner layers 450 µm 350 µm
K Base copper outer layer max. 18 µm max. 12 µm
L / E Aspect ratio 1 : 2 1 : 1,5

(1) process capability (CpK > 1,33)
(2) realisation after clarification



Microsection of a skipped via HDI:

tl_files/3-Technologien/images/designrules/hdi/schliffbild_skipped-hdi.jpg



Design rules for stacked vias:

tl_files/3-Technologien/images/designrules/hdi/drhdi_6.png

Symbol Description HDI (1) High End (2)
       
A Line width at copper thickness of ≥ 36 µm Cu 100 µm 80 µm
A1 Line width at copper thickness of 25 – 35 µm Cu 90 µm 75 µm
A 2 Line width at copper thickness of 10 – 18 µm Cu 75 µm 50 µm
B Spacing at copper thickness of ≥ 36 µm Cu 125 µm 100 µm
B 1 Spacing at copper thickness of 25 – 35 µm Cu 100 µm 85 µm
B 2 Spacing at copper thickness of 10 – 18 µm Cu 75 µm 75 µm
E 1 Diameter of microvia 125 µm < 100 µm
E 2 Diameter of microvia 200 µm 125 µm
F 1 Pad size diameter landing pad on inner layer 330 µm 250 µm
F 2 Microvia Landepad (Verbindungslage) 425 µm  < 375 µm
G 1 Diameter capture pad outer layers 330 µm  250 µm
G 2 Diameter capture pad outer layers 330 µm  250 µm
H Diameter CNC-hole 250 µm 150 µm
I 1 Diameter Pad CNC-hole outer layers 350 µm 250 µm
I 2 Pad diameter CNC-hole inner layers 450 µm 350 µm
K Base copper outer layer max. 18 µm max. 12 µm
L / E Aspect ratio 1 : 2 1 : 1

(1) process capability (CpK > 1,33)
(2) realisation after clarification

 

Microsection of a stacked via HDI:

tl_files/3-Technologien/images/designrules/hdi/drhdi_7b.jpg