Design rules for Multilayer PCBs

Properties:

  • Base material: FR4 or higher grade
  • max. 18 layers
  • PCB thicknesses from 0,6 mm to 3,2 mm
  • final layer with signature printing
  • peelable ink
  • copper thickness from 0,012 mm to 0,090 mm

Application:

Control units for cars, consumer- and communications-electronics, Industrial electronics

 

Design rules for inner layer:

tl_files/3-Technologien/images/designrules/multilayer/dr_ml_1.png

Symbol
Description
MDM (1)
High End (2)
A Line width core layer 150 µm 100 µm
A/x Line width core layer < 35 µm Cu 125 µm 75 µm
B Spacing core layer 150 µm 100 µm
B/x Spacing core layer < 35 µm Cu 125 µm 75 µm
C Line width inner layer 125 µm 75 µm
D Spacing inner layer 125 µm 75 µm
E Min. / max. total Core thickness 200 / 1000 µm 100 / 1500 µm
H Drill size through hole 300 µm 200 µm
  Layer count 6 > 8
I 1 Pad size through hole outer layer 500 µm 400 µm
I 2 Pad size through hole inner layer 600 µm 400 µm
J min. core layer thickness 150 µm 50 µm
K Base copper (core outer layer) max. 18 µm max. 18 µm

 

(1) process capability (CpK > 1,33)
(2) realisation after clarification

 

Design rule for outerlayer:

tl_files/3-Technologien/images/designrules/multilayer/dr_ml_2.png

Symbol Description MDM (1) High End (2)
A Line width core layer 100 µm 75 µm
A/x Line width core layer < 35 µm Cu 75 µm 50 µm
B Spacing core layer 150 µm 100 µm
B/x Spacing core layer < 35 µm Cu 125 µm 75 µm
C Hole in Pad, Padwidth Holediameter + 300 µm Holediameter + 150 µm
E Max. total Core thickness 2400 µm 2000 µm
H Drill size through hole 300 µm 200 µm
  Layer count 12 > 16
I 1

Pad size through hole outer layer

500 µm 400 µm
I 2 Pad size through hole inner layer 600 µm 500 µm
  Aspect Ratio 1 : 5 1 : 10

(1) process capability (CpK > 1,33)
(2) realisation after clarification

 

Microsection of a 6-layer Multilayer PCB:

tl_files/3-Technologien/images/designrules/multilayer/dr_ml_3.jpg